Microspary Cooling and applications in Microelectronics Cooling – 微熱傳增強研究室

Microspary Cooling and applications in Microelectronics Cooling

Micro spray cooling consists in spraying the hot surface with small diameter liquid droplets. If the droplet frequency is high enough, the surface may be covered with a continuous film of liquid, in which case the heat is mainly removed by convection and boiling form the surface. The major mechanisms include (1) convention mechanism (2) nucleate boiling mechanism (3) transition boiling mechanism, and (4) Film boiling mechanism, Two journal papers have been published.
Atomization is the term used to denote the transformation of bulk liquid into sprays and other physical dispersions of small particles in gaseous atmosphere. Faster and more power computers typically generate more heat. Conventional cooling techniques, which have fundamental limits that will fail to satisfy the demands of many next generation electronics. Spray cooling is frequently used in industrial processes to dissipate extremely high heat fluxes. A solid surface loses heat much more rapidly to small droplets of liquid impinging on it than it does the same liquid flowing continuously over it. High heat transfer rates are beneficial because they allow the size, cost, and complexity of heat exchange equipment to be reduced. The present study is to use R-134a and pure water to precede spray cooling and it will meet the current status of simulation IC and precision industry.